Reflow Oven Machine: Application and Various Usages!
• One can also buy much smaller reflow machines for small prototype and even rework areas. These naturally do not have the capability of the large machines, but instead they are tailored for the small PCB assembly and rework areas.
• As a matter of fact, reflow soldering is one of the most widely used forms of soldering for PCB assembly. They can be used in both mass production and for prototype PCB assembly. This type of soldering enables you reliable and effective operation for all pitches of leads and pads and also helps you to get very high quality circuit boards to be manufactured.
• This soldering technology gives you reliable soldering for the huge variety of component and different pad sizes while being easy to monitor and control.
• Another great benefit is the infrared reflow soldering. This has been used for many years in PCB assembly areas, and it is now able to provide very high quality soldering.
Reflow Oven
Machine: Application and Various Usages!
The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board. The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Now when you are using the soldering technology it is possible to rely easily solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.
Preparation
When it comes to the preparation, the first stage is to apply solder paste and components to the board. These stages are covered in more detail in a separate page on this section of the website.
Solder paste: Essentially, the solder paste is applied to the board. It is only applied to the areas that require soldering. While boards have solder resist layers added to them, it is necessary to only add solder paste to those areas where the solder is actually required.
One can achieve this with the help of a solder mask and solder paste "machine". It also allows the solder paste to be added in those areas of the board where it is very much needed. Once it is added on the board, it can move on to the next stage.
Pick and place: With the solder paste on the board the components can then be set in place. Normally an automatic pick and place machine is used because the numbers of components used these days and the accuracy required make manual placement non-viable.
The pick and place machine places the components onto the board, and they are held in place by the surface tension of the solder paste. It is very sufficient for normal handling; however, some care is obviously needed. It is possible for the components to be glued to the board, but this makes rework very difficult. Then with all the components in place they can be move to the reflow soldering machine.
Reflow soldering stage
The reflow process itself consists of a number of individual processes. These are required to ensure that the board is brought up to the correct temperature for reflow soldering without applying any unacceptable levels of thermal shock.
What Else?
So what else would you like to know about Reflow oven machine? Let us know in the comments section. Also, if you found this post helpful then feel free to share this post and keep following this space for more related updates.
No comments:
Post a Comment